Increased Dynamics with Double Pulse Decoupling: A Breakthrough in Air Bearing Technology

A new generation of air bearing positioning systems, featuring double pulse decoupling in both X and Y axes, is setting new standards for precision and speed in wafer-level link trimming. Developed through collaboration between 3D-Micromac and Eitzenberger, this technology enables extremely accurate and dynamic motion control. These features are crucial for advanced semiconductor manufacturing.

Key advancements include:

• Double Pulse Decoupling: This novel approach diverts reaction forces into a shared reaction mass, minimizing interference and maximizing dynamic performance.
• Vacuum-Groove Bearings: Integrated vacuum-groove bearings reduce weight and increase stiffness, resulting in a more compact and agile system.
• Exceptional Precision: The system achieves sub-100 nm positioning accuracy and up to 8 g acceleration, supported by high-resolution interferometry for minimal geometric deviation.
• Industry Impact: First unveiled at the Laser World of Photonics, this technology surpasses previous standards for accuracy, speed, and reliability in microelectronics production.

This breakthrough paves the way for higher packing densities and more efficient processes in the rapidly evolving microelectronics industry.

original published by microPRODUCTION magazine